Cracks: The Hidden Defect - Advanced Electronic Components

CRACKS: THE Hidden DEFECTby John MaxwellAVX CorporationAbstract:Cracks in ceramic chip capacitors can be introduced at any process step during surface mount shock has become a pat answer for all of these cracks, but about 75 to 80% originate fromother sources. These sources include pick and placemachine centering jaws, vacuum pick up bit, boarddepanelization, unwarping boards after soldering, testfixtures, connector insulation, final assembly, as well as defective Components . Each source has a unique signature in the type of crack that it develops so thateach can be identified as the source of in ceramic surface mount technology (SMT) Components limit assembly reliability and yields.

with temperature changes or assembly flexure during handling. In a matter of weeks a micro crack can propa-gate through the ceramic causing opens, intermittents or excessive leakage currents, a time bomb due to processing (Figure 6). Figure 5. The Micro Crack Location Figure 6. A Propagated Micro Crack After Power Cycling

Loading..

Tags:

  Component, Temperatures, During, Cycling

Information