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7th Generation IGBT Module T/T1-Series Application Note

METHOD OF ATTACHING THE MODULE TO THE HEAT SINK ... bonded terminal electrode is used as the main electrode instead of the conventional aluminum wire connection, and in some packages, the parallel plate structure is adopted. ・ Compact, lightweight package By adopting a single substrate structure and a US bonding technology, we have expanded ...

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  Heat, Compact, Bonded

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