Transcription of Accelerating Innovation Through a Standard Chiplet Interface
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Accelerating Innovation Through a Standard Chiplet Interface
White paper Heterogeneous Integration Accelerating Innovation Through A Standard Chiplet Interface : The Advanced Interface Bus (AIB). Authors Introduction David Kehlet The semiconductor industry has been on a decades-long quest to place as much Research Scientist functionality as possible on a single die. For most of that time, a monolithic Intel Programmable Solutions Group implementation has provided the best combination of performance, power, and capability, as compared to connecting two chips together using the packaging and interconnect technologies available at the time. Figure 1. An example of AIB application, where the analog front-end, signal Table of Contents pre-processing, and SERDES are connected, all by AIB, to an FPGA.
packaging that uses bumps spaced 130 or 150 microns apart. Application Presentation Session Transport Network Data Link Media Access Controller (MAC) Physical (PHY) Application Presentation Session Transport Network Data Link Physical (PHY) Figure 2. AIB is a physical-layer specification. This very fine pitch permits a single AIB interface to use
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