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Clech, SMTAI 05 Page 1 of 17 ACCELERATION FACTORS AND THERMAL cycling TEST efficiency FOR LEAD-FREE SN-AG-CU ASSEMBLIES Jean-Paul Clech EPSI Inc. Montclair, New-Jersey, USA Paper (copyright EPSI Inc. 2005) was presented at SMTA International, Chicago, IL, Sept. 25-29, 2005 ABSTRACT This paper reports on the development and application of a SAC THERMAL cycling solder joint reliability model. The strain-energy based model is used to study the effect of ramp rates, mean temperature, dwell times and temperature profile (sine vs. trapeze-like cycle) on SAC solder joint life. The model captures dwell time effects accurately. A detailed study of dwell time and ramp rate effects shows how accelerated THERMAL cycling profiles can be optimized to improve test efficiency .
clech, smtai’05 page 1 of 17 acceleration factors and thermal cycling test efficiency for lead-free sn-ag-cu assemblies jean-paul clech
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