Acceptability of Electronic Assemblies

IPC-A-610 DAcceptability of ElectronicAssemblies2nd Proposed Standard for BallotASSOCIATION CONNECTINGELECTRONICS INDUSTRIES 3000 Lakeside Drive, Suite 309S, Bannockburn, IL 60015-1219 Tel. Fax 2004A standard developed by IPCS upersedes A-610 CJanuary 2000 The Principles ofStandardizationIn May 1995 the IPC s Technical Activities Executive Committee adopted Principles ofStandardization as a guiding principle of IPC s standardization Should: Show relationship to Design for Manufacturability(DFM) and Design for the Environment (DFE) Minimize time to market Contain simple (simplified) language Just include spec information Focus on end product performance Include a feedback system on use andproblems for future improvementStandards Should Not: Inhibit innovation Increase time-to-market Keep people out Increase cycle time Tell you how to make something Contain anything that cannotbe defended with dataNoticeIPC Standards and Publications are designed to serve the public interest through eliminating mis-understandings between manufacturers and purchasers, facilitating interchangeability and improve-ment of products.

5.2.3 Reflow of Solder Paste 5-10 5.2.4 Nonwetting 5-11 5.2.5 Dewetting 5-12 5.2.6 Excess Solder 5-13 5.2.6.1 Solder Balls/Solder Fines 5-13 5.2.6.2 Bridging 5-15 5.2.6.3 Solder Webbing 5-16 5.2.7 Disturbed Solder 5-17 5.2.8 Fractured Solder 5-18 5.2.9 Solder Projections 5-19 5.2.10 Lead Free Fillet Lift 5-20

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