Transcription of Advanced IC Packaging as New Semiconductor …
{{id}} {{{paragraph}}}
Advanced IC Packaging as New Semiconductor industry collaboration platform CP Hung, VP of Corporate R&D ASE Inc. 25 Jun 2013 ASE Group. All rights reserved. 2 Content Appliances Evolution Enriching Life Driven Semi industry Appliances Interface Migration IC Packages industry -wide Paradigm Shift IC Packages Technology Roadmap & Challenges Interaction in Semi Value Chain Summary ASE Group. All rights reserved. 3 Ref: ASE, Forrester Research, 6 Fusion Appliances Evolution ASE Group. All rights reserved. 4 Ref: ASE, Forrester Research, 6 Fusion Appliances Interface Migration Key-in & Click-in Touch & Slide Voice & Motion Brain Wave & Hybrid Senses Versatile Interface Active Interaction Passive Appliances ASE Group.
Advanced IC Packaging as New Semiconductor Industry Collaboration Platform CP Hung, Ph.D. VP of Corporate R&D ASE Inc. 25 Jun 2013
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
{{id}} {{{paragraph}}}