Transcription of Panel Discussion: Advanced Packaging - The ConFab
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Panel Discussion: Advanced Packaging - The ConFab
Dr. Steve Bezuk Senior Director IC Packaging Engineering Qualcomm Technologies, Inc. Panel discussion : Advanced Packaging PAGE 1. Technical Challenges of Packaging (Mobile Focus). Materials Thermal Die materials Poor Thermal Paths Low K and Extreme Low K Dielectrics No Air Flow, Closed System Fine Pitch Interconnects (<100mm) Substrate materials engineered for: Electrical Modulus, fracture toughness, CTE, Tg, Signal Integrity shrinkage, cure temperature and kinetics, adhesion to multiple materials, dielectric Power DistribuLon properties (frequency dependence).
PAGE 1 Panel Discussion: Advanced Packaging Dr. Steve Bezuk Senior Director IC Packaging Engineering Qualcomm Technologies, Inc.
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