Transcription of Advanced Packaging Current Trends & Challenges
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Advanced Packaging Current Trends & Challenges
2020 From Technologies to MarketsAdvanced Packaging Current Trends & Challenges9 Advanced Packaging PLATFORMS Classification at System Integration LevelWafer levelSubstrate/Strip level (Panel based)Panel levelLevel 1 -DieInterconnectionSubstrate/ leadframeLevel 2 - Packaging ModuleLevel 3 -No SMT neededSiP/PoP, in PCB/FlexED in laminateOrganic/glass substrate organic substrateFlip-chipWire-bondRDLFIWLPFOWLP 3 glass bridgeBump/pillarTSV/ TGVC eramic/ leadframe and othersAdvanced organic substrateMold embeddingOrganic interposerFCWBCSPBGA StandardBGA AdvancedLGABGALGACSPO rganic substrateCeramic/ leadframe and othersFCWBAP platform10 2018 | | Status of the Advanced Packaging Industry 2018 Advanced Packaging MARKET SHARE EVOLUTION 2014-2025 Advanced Packaging revenue will almost equal to traditional Packaging revenue by 2019, the AP market share was Due to strong momentum in AP market driven by mega Trends , the share of AP in the total semiconductor market is increasing continuously and will reach almost 50% of the market by 2014.
Organic/ glass substrate etc. Standard organic substrate Flip-chip Wire-bond RDL FIWLP FOWLP 3D/2.5D FOPLP Silicon/ glass bridge Bump/ pillar TSV/ TGV Ceramic/ leadframe and others Advanced organic substrate Mold embedding Organic interposer FC WB CSP BGA Standard BGA Advanced LGA BGA LGA CSP Organic substrate Ceramic/ leadframe and …
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