Transcription of 裸片到裸片接口IP的新疆域:芯片成功的需知
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IP . Leong Zhang 2020 10 28 .. Synopsys Confidential Information 2020 Synopsys, Inc. 2.. 2027 1770 . ). 200,000. 180,000. 160,000. 140,000. 2027 . 1776 2018 705 . 120,000.. 100,000. 2030 260 . 80,000. 60,000. 7nm 3nm . IP . 40,000. 20,000. 0. 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026 2027. IBS 2019 . Synopsys Confidential Information 2020 Synopsys, Inc. 3. Synopsys .. SerDes 112G 112G 112G.. 400/800G D2D D2D D2D .. D2D. DDR5. DDR5. DDR5 DDR5.. DDR5 . USR 56G XSR 112G HBI.. CPU. TCAM MP.. PCIe . Hardware root of trust . 100 TRNG . HBM. HBM. HBM . HBM. CXL DRAM PCIe/CXL DRAM. I/O. CXL AI HBM. CXL . HBM2e 3600 HBM3 6400. CCIX CXL . Synopsys Confidential Information 2020 Synopsys, Inc. 4. SiP SoC . Fragmented Market . interposer HBI.
y Organic Substrate Data Rate: 112Gbps Line Space: >10mm Integrated Fanout (InFO) Post Fab RDL (Fanout) Data Rate: 56Gbps Line Space: >2mm, 2500 Pin Count Silicon Interposer Data Rate: 3.2 →6.4Gbps Line Space: >0.4mm, 4000 Pin Count Die/Package Size, Density & IO Count Data Rates Y Y
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