Transcription of Advanced Packaging Current Trends & Challenges
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2020 From Technologies to MarketsAdvanced Packaging Current Trends & Challenges9 Advanced Packaging PLATFORMS Classification at System Integration LevelWafer levelSubstrate/Strip level (Panel based)Panel levelLevel 1 -DieInterconnectionSubstrate/ leadframeLevel 2 - Packaging ModuleLevel 3 -No SMT neededSiP/PoP, in PCB/FlexED in laminateOrganic/glass substrate organic substrateFlip-chipWire-bondRDLFIWLPFOWLP 3 glass bridgeBump/pillarTSV/ TGVC eramic/ leadframe and othersAdvanced organic substrateMold embeddingOrganic interposerFCWBCSPBGA StandardBGA AdvancedLGABGALGACSPO rganic substrateCeramic/ leadframe and othersFCWBAP platform10 2018 | | Status of the Advanced Packaging Industry 2018 Advanced Packaging MARKET SHARE EVOLUTION 2014-2025 Advanced Packaging revenue will almost equal to traditional Packaging revenue by 2019, the AP market share was Due to strong momentum in AP market driven by mega Trends .
technology or IP for merger and acquisition as an exit strategy. Large OSATs were separated from the rest. Top 8 OSATs continued with heavy investment in CapEx and R&D. **Note: SPIL included in ASE figures from 2019 onwards 8,456 4,053 3,285 2,209 1,169 1,085 848 710 678 675 582 484 405 399 398 339 334 314 289 286 267 264 247 223 157 ASE (rev w ...
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