Transcription of SEMICONDUCTOR PACKAGING ROADMAP SYMPOSIUM
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SEMICONDUCTOR PACKAGING ROADMAP SYMPOSIUM
MONDAY, NOVEMBER 14, 2016 | SAN JOSE, CALIFORNIA20402030 MEPTEC 2016 SEMICONDUCTOR PACKAGINGROADMAP SYMPOSIUMMEPTEC INITIATES COLLABORATION WITH HETEROGENEOUS INTEGRATION ROADMAPPARTICIPATING COMPANIES: ADVANCED MICRO DEVICES ASE GROUP CADENCE DESIGN SYSTEMS CISCO SYSTEMS, INC. COUGHLIN ASSOCIATES DARPA GLOBALFOUNDRIES INTEL MASSACHUSETTS INSTITUTE OF technology ROBERT BOSCH LLC THIRD MILLENNIUM TEST SOLUTIONS UC LOS ANGELES UC SAN DIEGO XILINXPREMIER SPONSORDIAMOND SPONSORGOLD SPONSORGOLD SPONSORGOLD SPONSORBREAK SPONSORMEDIA SPONSORSASSOCIATION SPONSORSCONTENTSAGENDASPONSOR AND EXHIBITOR DIRECTORIESPARTICIPANT BIOGRAPHIESPRESENTATIONS MORNING KEYNOTE: Heterogeneous Integration: Enabling the Future of the Electronic Industry Wilmer R. Bottoms, , Chairman, Third Millennium Test Solutions and Co-chair, Heterogeneous Integration ROADMAP SESSION 1 DRIVERS FOR HETEROGENEOUS INTEGRATION Grand Challenges and Timelines for Electronic-Photonic Integration Lionel C.
roadmap symposium meptec initiates collaboration with heterogeneous integration roadmap participating companies: • advanced micro devices • ase group • cadence design systems • cisco systems, inc. • coughlin associates • darpa • globalfoundries • intel • massachusetts institute of technology • robert bosch llc
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