Transcription of AN136 - PCB Layout Considerations for Non …
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Application Note 136AN136-1an136fJune 2012and electrolytic capacitors should not block the air flow to the low profile, surface mount semiconductor compo-nents such as power MOSFETs, PWM controller, etc. To prevent the switching noise from upsetting other analog signals in the system, avoid routing sensitive signal traces underneath the supply if possible. Otherwise, an internal ground plane between the power supply layer and small signal layer is needed for shielding. It is necessary to point out that this power supply loca-tion and board real estate planning should be done at the early design/planning stage of the system. Unfortunately, sometimes people focus on other more important or exciting circuits on the big system board first.
Application Note 136 AN136-2 an136f capacitive noise coupling between the high current/voltage power layer and small analog signal layer. To minimize
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Reduction of the High-Frequency Switching Noise, REDUCTION OF THE HIGH FREQUENCY SWITCHING NOISE, High, Switching frequency, Power Supply Noise Reduction, Frequency, Decoupling Techniques, Analog Devices, Frequency noise, High frequency, Noise, Texas Instruments, To-DC Converter Noise Reduction, Reduction, UNDERSTANDING AND CONTROLLING, Switching, Noise Reduction, High Power Laser Diode Driver Based, High Power Laser Diode Driver Based on Power Converter Technology, Integrating EMI Filters and Appliance Motor Controls