Transcription of AN2409, Small Outline Integrated Circuit (SOIC) Package ...
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AN2409, Small Outline Integrated Circuit (SOIC) Package ...
Freescale Semiconductor, Note Freescale Semiconductor, Inc., 2014. All rights Number: AN2409 Rev. , 10/2014 Contents1 Introduction..12 Scope ..13 Small Outline Integrated Circuit ..24 Printed Circuit Board Guidelines ..45 Board Assembly .. 106 Repair and Rework Procedure .. 147 Board Level Reliability ..168 Thermal Characteristics .. 189 Case Outline Drawing, MCDS and MSL Rating 2010 Package Handling .. 2111 References .. 2612 Revision History .. 271 IntroductionThis application note provides guidelines for handling and assembly of Freescale Small Outline Integrated Circuit (SOIC) Package during Printed Circuit Board (PCB) assembly. Guidelines for PCB design, rework, and Package performance information such as Moisture Sensitivity Level (MSL) rating, board level reliability, mechanical and thermal resistance data are included for document contains generic information that encompasses various Freescale SOIC packages assembled internally or at external subcontractors.
3 Small Outline Integrated Circuit Figure 1 shows the standard SOIC offerings through Freescale. The exposed pad (denoted as -EP) version is also displayed. Figure 1. Standard Freescale SOIC Offerings 3.1 Package Description The SOIC is a surface mount integrated circuit package. The sta ndard form is a flat rectangular body, with leads ...
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