Search results with tag "Small outline"
Part II How to Design and Build Working Electronic Circuits
www-mdp.eng.cam.ac.ukoutline IC), SOP (small outline package), SSOP (shrink small outline package), TSOP (thin small outline package). Larger SMT ICs such as microprocessors use quad-flatpak (QFP). ... breadboard before designing a prototyping PCB. However, in commercial electronics design, TH packages are essentially an obsolete technology used only for high power ...
MPXV7002, Integrated silicon pressure sensor, on-chip ...
www.nxp.comSmall outline packages 5 Block diagram aaa-040606 THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 2 3 Se nsi g 4 element Pins 1, 5, 6, 7 and 8 are NO CONNECTS for small outline package device VS Vout GND GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY Figure 1. Integrated pressure sensor schematic
AN2409, Small Outline Integrated Circuit (SOIC) Package ...
www.nxp.com3 Small Outline Integrated Circuit Figure 1 shows the standard SOIC offerings through Freescale. The exposed pad (denoted as -EP) version is also displayed. Figure 1. Standard Freescale SOIC Offerings 3.1 Package Description The SOIC is a surface mount integrated circuit package. The sta ndard form is a flat rectangular body, with leads ...
SOD523 - NXP
www.nxp.comPackage style descriptive code SOD (small outline diode) Package style suffix code NA (not applicable) Package body material type P (plastic) JEITA package outline code SC-79 Mounting method type S (surface mount) Issue date 16-3-2006 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 1.15 - 1.2 1.25 mm
Integrated Silicon Pressure Sensor MPX5010 On-Chip Signal ...
www.nxp.comFigure 4 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the ... SMALL OUTLINE PACKAGE S D 8 PL G 4 5 8 1 0.25 (0.010) M T B SA-A--B-N C M J K PIN 1 IDENTIFIER H SEATING PLANE-T-DIM MIN MAX MIN MAX INCHES MILLIMETERS
LT1028/LT1128 - Ultralow Noise Precision High Speed Op Amps
www.analog.comachieve a new standard of excellence in noise performance with 0.85nV/√Hz 1kHz noise, 1.0nV/√Hz 10Hz noise. ... S8 PACKAGE 8-LEAD PLASTIC SOIC V+ ... LT1128CS8#PBF LT1128CS8#TRPBF 1128 8-Lead Plastic Small Outline 0°C to 70°C LT1028CSW#PBF LT1028CSW#TRPBF LT1028CSW 16-Lead Plastic SOIC (Wide) 0°C to 70°C ...
LM555 Timer datasheet (Rev. D) - TI.com
www.ti.comInformation Small Outline Packages (SOIC and Vapor Phase (60 Seconds) 215 °C VSSOP) Infrared (15 Seconds) 220 °C ... reset on falling waveforms, and the output circuit can source or sink up to 200mA or driver TTL circuits. The LM555 are available in 8-pin PDIP, SOIC, and VSSOP packages and is a direct replacement for SE555/NE555. ...
AT28C16 16K (2K x 8) Parallel EEPROMs - Stanford University
cva.stanford.eduPackage Type 32J 32 Lead, Plastic J-Leaded Chip Carrier (PLCC) 24P6 24 Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 24S 24 Lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC) W Die Options Blank Standard Device: Endurance = 10K Write Cycles; Write Time = 1 ms E High Endurance Option: Endurance = 100K Write Cycles; Write Time ...