Transcription of AN900 APPLICATION NOTE - STMicroelectronics
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AN900 APPLICATION NOTE - STMicroelectronics
AN900 /11001/15AN900 APPLICATION NOTEINTRODUCTION TO SEMICONDUCTOR TECHNOLOGYby Microcontroller Division ApplicationsINTRODUCTIONAn integrated circuit is a small but sophisticated device implementing several electronic func-tions. It is made up of two major parts: a tiny and very fragile silicon chip (die) and a packagewhich is intended to protect the internal silicon chip and to provide users with a practical wayof handling the component. This note describes the various front-end and back-end manu-facturing processes and takes the transistor as an example, because it uses the MOS tech-nology. Actually, this technology is used for the majority of the ICs manufactured at TO SEMICONDUCTOR TECHNOLOGY1 THE FABRICATION OF A SEMICONDUCTOR DEVICEThe manufacturing phase of an integrated circuit can be divided into two steps. The first,wafer fabrication, is the extremely sophisticated and intricate process of manufacturing thesilicon chip.
Identical integrated circuits, called die, are made on each wafer in a multi-step process. Each step adds a new layer to the wafer or modifies the existing one. These layers form the ele-ments of the individual electronic circuits. The main steps for the fabrication of a die are summarized in the following table. Some of
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