Transcription of Analog | Embedded processing | Semiconductor company | TI.com
{{id}} {{{paragraph}}}
1 SPRA953C December2003 RevisedApril2016 SubmitDocumentationFeedbackCopyright 2003 2016,TexasInstrumentsIncorporatedSemicon ductorand IC PackageThermalMetricsApplicationReportSP RA953C December2003 RevisedApril2016 Semiconductorand IC PackageThermalMetricsDarvinEdwards,HiepN guyenABSTRACTM anythermalmetricsexistfor semiconductorand integratedcircuit(IC) packagesrangingfromR JAto JT. Often,thesethermalmetricsare misappliedby thosewhotry to use themto estimatejunctiontemperaturesin documentdescribestraditionaland new thermalmetricsand puts theirapplicationin perspectivewith respectto JAJunction-to-Ambientand R JT, Junctionto Top of (JB) of Figures11s vs 2s2pPCBfor SizeImpacton a JAvs (JB) of Tables1 FactorsAffectingR JAfor a JTfor a registeredtrademarkof othertrademarksare the propertyof theirrespectiveowners.
Moved Permanently. The document has moved here.
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
{{id}} {{{paragraph}}}