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2012 Analysis of innovation trends in packaging for power modules 7th European Advanced Technology Workshop on Micropackaging and Thermal Management February 1st & 2nd IMAPS 2012 Jean-Marc YANNOU, Alexandre Avron, 2012 2 Content Introduction Standard module package cross section drawing Key innovation areas Die interconnection Die attach Substrates (DBC, baseplate) and encapsulation Focus on EV/HEV packaging trend in EV/HEV Case studies: GM, Denso, Conclusions 2012 3 Introduction Standard module package cross section drawing Heatsink Thermal grease Substrate SBD IGBT Baseplate DBC Busbar connection Solder Copper metallization Plastic case Common failure in a power module is caused by thermal cycling. Mismatching CTEs (coefficient of thermal expansion) incur adhesion issues, cracks. Some filling gels cannot handle high temperatures Die attach Interconnection Gel filling Substrates attach In red: Common failure locations 2012 4 Introduction Key innovation areas in packaging , with examples Die interconnection DBC + baseplate Die attach Infineon.
© 2012 •2 Content •Introduction –Standard module package cross section drawing –Key innovation areas •Die interconnection •Die attach …
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