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ASSOCIATION CONNECTING ELECTRONICS …
IPC-6016 Qualification and PerformanceSpecification for High DensityInterconnect (HDI) Layersor BoardsASSOCIATION CONNECTINGELECTRONICS INDUSTRIES2215 Sanders Road, Northbrook, IL 60062-6135 Tel. Fax 1999A standard developed by IPCFOREWORDThis specification is intended to provide information on the detailed performance criteria of High Density Interconnect lay-ers only. The information contained herein supplements the generic requirements, identified in IPC-6011, as well as require-ments relating to the core construction, identified in the sectionals: IPC-6012 (rigid), IPC-6013 (flex), IPC-6015 (MCM-L)or IPC-6018 (microwave).
IPC-6016 Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES
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