Transcription of ASSOCIATION CONNECTING ELECTRONICS …
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ASSOCIATION CONNECTING ELECTRONICS …
J-STD-005 Requirements forSoldering PastesA joint standard developed by the Solder Paste Task Group(5-22b) of IPCU sers of this standard are encouraged to participate in thedevelopment of future :EIAE ngineering Department2500 Wilson BoulevardArlington, VA 22201 Phone (703) 907-7500 Fax (703) 907-7501 IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1219 Tel (847) 615-7100 Fax (847) 615-7105 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES March 21, 1995 Table of .. Standards .. Standards Organization .. Society for Testing Materials .. Requirements .. Description for Powder Particle Size .. Percent .. Test .. Ball Test .. Test .. ASSURANCE for of Report Form .. Inspection .. FOR Life .. 8 FiguresFigure 1 Slump test stencil thickness mm .. 4 Figure 2 Slump test stencil thickness mm .. 5 Figure 3 Solder ball test standards .. 6 Figure 4 Solder Paste Inspection Report 7 TablesTable 1 Standardized Solder Paste Description.
Requirements for Soldering Pastes 1.0 SCOPE 1.1 Scope This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections.
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