Transcription of ASSOCIATION CONNECTING ELECTRONICS …
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ASSOCIATION CONNECTING ELECTRONICS …
IPC-HDBK-005 guide to SolderPaste AssessmentDeveloped by the solder Paste Task Group (5-24b) of the Assemblyand Joining Processes Committee (5-20) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1219 Tel 847 847 CONNECTINGELECTRONICS INDUSTRIES Table of .. and Definitions .. solder Paste .. 12 APPLICABLE .. Industry Standards .. Electrotechnical CommissionDocuments .. of Wetting .. of Wetting .. Measurement .. Affecting Solderability DuringReflow Soldering Process .. Surface Finish .. Air solder Leveling (HASL) .. Coating .. Solderability Preservatives (OSP).. Lead Composition/Finish .. Metal .. Composition .. Coated Leads .. Coated Leads .. or Pt Plated Leads .. Coating Processes .. Paste .. Alloy .. Particle Size .. Testing .. Paste Wetting Tests .. Test Documents.
Guide to Solder Paste Assessment 1 SCOPE This handbook is a companion to the solder paste standard J-STD-005 and should be considered to be a guide to help
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