Transcription of ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES …
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IPC- hdbk -005 guide to SolderPaste AssessmentDeveloped by the solder Paste Task Group (5-24b) of the Assemblyand Joining Processes Committee (5-20) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1219 Tel 847 847 CONNECTINGELECTRONICS INDUSTRIES Table of .. and Definitions .. solder Paste .. 12 APPLICABLE .. Industry Standards .. Electrotechnical CommissionDocuments .. of Wetting .. of Wetting .. Measurement .. Affecting Solderability DuringReflow Soldering Process .. Surface Finish .. Air solder Leveling (HASL) .. Coating .. Solderability Preservatives (OSP).. Lead Composition/Finish .. Metal .. Composition .. Coated Leads .. Coated Leads .. or Pt Plated Leads.
IPC-HDBK-005 Guide to Solder Paste Assessment Developed by the Solder Paste Task Group (5-24b) of the Assembly and Joining Processes Committee (5-20) of IPC
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HDBK-001F: Handbook and Guide to Supplement, HDBK-001F Handbook and Guide to Supplement, HDBK, Electronic Design Handbook, HDBK-701 - Military Handbook Blocking, Bracing and, Military Handbook Blocking, Bracing and, 0IIII AD-A261 755 I I Ii1111, 0IIII AD-A261 755 I "" I Ii1111, DEPARTMENT OF DEFENSE HANDBOOK COMPANION, Department of defense handbook, 252 – Wood Crate Design Manual, 252 Wood Crate Design Manual HDBK