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ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES In …
IPC-9261 AIn- process dpmo andEstimated yield for PCAsDeveloped by the dpmo and Assemblies, Attributes and VariablesIdentification Task Group (5-22g) of the Assembly and Joining ProcessesCommittee (5-20) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1249 Tel 847 847 :IPC-9261 - March 2002 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES Table of .. and Definitions .. (Defects per Million Opportunities) .. (Defects per Unit) .. Step estimated yield .. Opportunities (oc).. Defect (dc) .. Opportunity (op) .. Defect (dp) .. Opportunity (ot).. Defect (dt).. Assembly Opportunity (oa).. Assembly Defect (da).. 22 APPLICABLE 23 CALCULATION OF IN- process of In- process Metrics -Assumptions .. Examples .. of Placement dpmo .. of Termination dpmo .
In-Process DPMO and Estimated Yield for PCAs 1 OVERVIEW 1.1 Scope This document defines standard methodolo- gies for calculating defects per million opportunities (DPMO) metrics related to electronic printed board assem-
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