Transcription of Ball Grid Array (BGA) Packaging - Intel
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Ball Grid Array (BGA) Packaging - Intel
2000 Packaging Databook 14-1 Ball Grid Array (BGA) plastic ball grid Array (PBGA) has become one of the most popular Packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems and minimized handling issues. During reflow the solder balls are self-centering (up to 50% off the pad), thus reducing placement problems during surface mount. Normally, because of the larger ball pitch (typically mm) of a BGA over a QFP or PQFP, the overall package and board assembly yields can be better. From a performance perspective, the thermal and electrical characteristics can be better than that of conventional QFPs or PQFPs.
the package. Secondly, because the copper heatspreader forms the top of the package, the thermal resistance is extremely low and exposes the package surface to available air flow. If required, this heatslug can be directly coupled to active or passive thermal management devices such as heat sinks or heat pipes.
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