Transcription of Ball Grid Array (BGA) Packaging - Intel
{{id}} {{{paragraph}}}
2000 Packaging Databook 14-1 Ball Grid Array (BGA) plastic ball grid Array (PBGA) has become one of the most popular Packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems and minimized handling issues. During reflow the solder balls are self-centering (up to 50% off the pad), thus reducing placement problems during surface mount. Normally, because of the larger ball pitch (typically mm) of a BGA over a QFP or PQFP, the overall package and board assembly yields can be better.
Figure 14-7. PBGA Outline Drawing A5766-01 Pin #1 Corner D D1 45 Chamfer 4 Places E E1 Pin #1 I.D. 1.0 Dia. b Pin #1 Corner S1 e 1.0 3 Places A2 30 A1 A C Top View Bottom View Side View Seating Plane ˚ ˚ 1. All Dimensions are in Millimeters Note: Table 14-5. PBGA Package Family Dimensions PBGA Package Dimensions Min Max Min Max Min Max Min ...
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
{{id}} {{{paragraph}}}