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BCD Technology and Cost Comparison 2020 - System Plus ...

2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 20201SP2048522 Bd Benoni Goullin44200 NANTES -FRANCE+33 2 40 18 09 Technology and Cost Comparison 2020SP20485 IC report by Sylvain HallereauJanuary 2020 SampleIn-depth comparative study of 31 Bipolar-CMOS-DMOS technologies with a focus on Silicon-on-Insulator high voltage devices from the 15 major leading COSTING STRUCTURAL, PROCESS & COST REPORT 2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 20202SP20485 Table of ContentsOverview / Introduction4oExecutive SummaryTechnologies Evolution10oTransistors Gate Oxides LDMOS and VDMOS SummaryoInsulation LOCOS and STI Deep trench isolation Substrate SOI SummaryoMetal Layer Process Aluminum and Tungsten Plug Copper Metal layer thick metal layer SummaryoPassives Capacitor in polysilicon resistor in polysilicon Metal Insulator Metal Capacitor Thin film resistors Inductors SummaryoShrinkoHigh VoltageFoundry Technologies41oInfineon Roadmap SPT9 process Transistors, Insulation, Metal Layer, Passives Synthese SMART6 process Infineon s Thin- film SOI-technologyoSTMicroelectronics: BCD6s, SOI-BCD6s, BCD8, BCD9, VIPowerM0-3, VIPowerM0-5, VIPowerM0-7oElmos: BCD moBosch: BCD6, BCD8oNXP.

Thick metal layer Summary oPassives Capacitor in polysilicon Resistor in polysilicon Metal Insulator Metal Capacitor Thin Film resistors Inductors Summary o Shrink o High Voltage Foundry Technologies 41 o Infineon Roadmap SPT9 process Transistors, Insulation, Metal Layer, Passives Synthese SMART6 process

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