BCD Technology and Cost Comparison 2020 - System Plus ...

1 2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 20201SP2048522 Bd Benoni Goullin44200 NANTES -FRANCE+33 2 40 18 09 Technology and Cost Comparison 2020SP20485 IC report by Sylvain HallereauJanuary 2020 SampleIn-depth comparative study of 31 Bipolar-CMOS-DMOS technologies with a focus on Silicon-on-Insulator high voltage devices from the 15 major leading COSTING STRUCTURAL, PROCESS & COST REPORT 2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 20202SP20485 Table of ContentsOverview / Introduction4oExecutive SummaryTechnologies Evolution10oTransistors Gate Oxides LDMOS and VDMOS SummaryoInsulation LOCOS and STI Deep trench isolation Substrate SOI SummaryoMetal Layer Process Aluminum and Tungsten Plug Copper Metal layer thick metal layer SummaryoPassives Capacitor in polysilicon resistor in polysilicon Metal Insulator Metal Capacitor Thin film resistors Inductors SummaryoShrinkoHigh VoltageFoundry Technologies41oInfineon Roadmap SPT9 process Transistors, Insulation, Metal Layer, Passives Synthese SMART6 process Infineon s Thin- film SOI-technologyoSTMicroelectronics: BCD6s, SOI-BCD6s, BCD8, BCD9, VIPowerM0-3, VIPowerM0-5, VIPowerM0-7oElmos: BCD moBosch: BCD6, BCD8oNXP.

2 A-BCD3, A-BCD9oIXYS: BCDMOS on SOI High VoltageoFreescale: SMARTMOS8, SMARTMOS10oON SemicondcutoroTexas Instruments: LBC5, LBC5-SOI, LBC8, LBC9 oLinear Technology : BCD moAnalog devices: BCD m,BCD moMaxim TowerJazz: BCD moDenso: SOI-BCD m, SOI-BCD moRenesas: moToyota: SOI-BCD moToshiba: SOI High VoltageoComparisonsFeedback Company services366In redthe technologies high voltage addedin black, the new technologies addedin the 2020 report. 2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 20203SP20485 Overview/ IntroductionoExecutive SummaryoGlossaryoReverse Costing MethodologyEvolution of BCD TechnologiesFoundry technologies ReviewComparisonFeedbacksRelatedReportsA bout System PlusExecutive Summary Thisreportpresentsanin-depthanalysisofth elatestinnovationsinBipolar-CMOS-DMOS(BC D)devices.

3 Itshowsshowingthedifferencesbetween31sel ecteddevicesfromInfineon,STMicroelectron ics,Elmos,Bosch,NXP,IXYS,Freescale,Texas Instruments,LinearTechnology,AnalogDevic es,Maxim/TowerJazz,Denso,Renesas, Thise2020versionaddseightnewtechnologies fromsevenexistingmanufacturers,andanothe rthreenewmanufacturers,IXYS, ,over200 Vandupto600V,withtheSilicon-on-Insulator (SOI)-basedsolutionsfromInfineonat600V, , Foreachanalyzeddevice,thetechnologyrepor tdetailsthemanufacturingprocessandmateri alsused, ,highlightingtheinfluenceofthetechnologi calinnovations. Thisreportprovidesauniqueopportunitytoun derstandthetechnologyevolutionsandtheman ufacturingcostofthemajorBCDmanufacturers ,togivethebasicsforanoptimalchoiceofcomp onentsduringdesignandintegration. Inthereport, ,thetransistors,themetallayers,theinsula tionandthepassivedevices. 2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 20204SP20485 Overview/ IntroductionoExecutive SummaryoGlossaryoReverse Costing MethodologyEvolution of BCD TechnologiesFoundry technologies ReviewComparisonFeedbacksRelatedReportsA bout System PlusTechnologies Summaryby FounderInfineon:SMART6 SPT9 Infineon sSOI-technologySTMicroelectronics:BCD6sS OI-BCD6sBCD8 BCD9 VIPowerM0-3 VIPowerM0-5 VIPowerM0-7 mBosch:BCD6 BCD8 NXP:A-BCD3 SOIA-BCD9 SOIIXYS:SOIHighVoltageFreescale(nowNXP): SMARTMOS8 SMARTMOS10 WTexasInstruments:LBC5 LBC5-SOILBC8 LBC9 mMaxim/TowerJazz(Foundry) m, mToyota: SOI-BCD mToshiba.

4 SOI High VoltageNew analyses respect to the report SP17335 -BCD Technology and Cost review 2017 published 2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 20205SP20485 Overview/ IntroductionoExecutive SummaryoGlossaryoReverse Costing MethodologyEvolution of BCD TechnologiesFoundry technologies ReviewComparisonFeedbacksRelatedReportsA bout System PlusTechnologies Summary 2020 NewsNew technologyin the Review2020:oInfineon:BCD SOI-technologyoSTMicroelectronics: BCD9 ( m)oIXYS:SOI High VoltageoTexasInstruments:LBC5-SOI( m)oTexasInstruments:LBC9( m) moTowerJazz(Foundry) moToshiba: SOI High VoltageSOIandHighvoltagetechnologies:oIn fineon:BCDSOI-technologyoIXYS:SOIHighVol tageoToshiba:SOIHighVoltageIn redthe technologies high voltage addedin black, the new technologies addedin the 2020 report. 2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 20206SP20485 Overview/ IntroductionEvolution of BCD TechnologiesoTransistorsoInsulationoMeta lLayersoPassiveoHigh VoltageFoundry technologies ReviewComparisonFeedbacksRelatedReportsA bout System PlusTechnologies OverviewBCD or Bipolar-CMOS-DMOS has been imagined and developed to simplify the control of the power devices by proposing a monolithic solution to integrate the gate driving circuit and current and temperature measurements to protect the power component in a samesilicon circuit.

5 Today BCD technologies allow to integrate a microcontroller with logic, memory, analogic and power functionsonthe same circuit. BCD combines the strengths of three different transistors onto a single chip: Bipolar for precise analog functions, CMOS (Complementary Metal Oxide Semiconductor) for digital design and DMOS (Double Diffused Metal Oxide Semiconductor) for power and association of technologies brings many advantages: reduced electromagnetic interferences smaller chip area smaller PCB footprint and bill of materialUsed in a wide range of applications the BCD is available for different applications: high voltage: power actuator high density: added high voltage to a microcontroller high precision analog: analog data acquisition low leakage IC for wireless: power managementThe first BCD circuits were made with a few CMOS and bipolar transistors added to the LDMOS high voltage to drive and measure.

6 Since then the Technology made a huge improvement by re-inventing Technology initially developed for advanced CMOS like SOI substrate,dual oxides, copper metal layer or for the MOSFET and IGBT discrete transistors like the trenches. 2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 20207SP20485 Overview/ IntroductionEvolution of BCD TechnologiesoTransistorsoInsulationoMeta lLayersoPassiveoHigh VoltageFoundry technologies ReviewComparisonFeedbacksRelatedReportsA bout System PlusTransistor -Gate OxidesBCD m die from BoschBCD m die from Linear Technology 2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 20208SP20485 Overview/ IntroductionEvolution of BCD TechnologiesoTransistorsoInsulationoMeta lLayersoPassiveoHigh VoltageFoundry technologies ReviewComparisonFeedbacksRelatedReportsA bout System PlusTransistor -Vertical DMOSI nfineon SPT4 Technology .

7 Trench MOSFET cross-section SEM view 2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 20209SP20485 Overview/ IntroductionEvolution of BCD TechnologiesFoundry technologies ReviewoInfineon: SPT9, SMART6, SOIoSTMicroelectronics: BCD6s, SOI-BCD6s, BCD8s, BCD9, VIPowerM0-3, 5 and 7oElmos: moBosch: BCD6, BCD8oNXP: A-BCD3, A-BCD9oIXYS: SOI high VoltageoFreescale: SMARTMOS8, SMARTMOS10 WoTexas Instruments: LBC5, LBC5-SOI, LBC8, LBC9oLinear Technology : BCD moAnalog Devices: BCD m, BCD moMaxim-TowerJazz: BCD moDenso: m, SOI-BCD moRenesas: BCD moToyota: SOI-BCD moToshiba: SOI high VoltageComparisonFeedbacksRelatedReports About System PlusInfineon SPT9 Characteristics Die ExampleIC Die Overview -Optical ViewDie Delayering-Removal of Metal Layers Infineon Technology die manufactured with SPT9 Technology .

8 Die dimension: 3-Phase Bridge Driver IC used in Automotive applications. 2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 202010SP20485 Overview/ IntroductionEvolution of BCD TechnologiesFoundry technologies ReviewoInfineon: SPT9, SMART6, SOIoSTMicroelectronics: BCD6s, SOI-BCD6s, BCD8s, BCD9, VIPowerM0-3, 5 and 7oElmos: moBosch: BCD6, BCD8oNXP: A-BCD3, A-BCD9oIXYS: SOI high VoltageoFreescale: SMARTMOS8, SMARTMOS10 WoTexas Instruments: LBC5, LBC5-SOI, LBC8, LBC9oLinear Technology : BCD moAnalog Devices: BCD m, BCD moMaxim-TowerJazz: BCD moDenso: m, SOI-BCD moRenesas: BCD moToyota: SOI-BCD moToshiba: SOI high VoltageComparisonFeedbacksRelatedReports About System PlusInfineon SPT9 Transistors100 nm115 nmLDMOS Transistors (SEM view).High density CMOS -top view 2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 202011SP20485 Overview/ IntroductionEvolution of BCD TechnologiesFoundry technologies ReviewoInfineon: SPT9, SMART6, SOIoSTMicroelectronics: BCD6s, SOI-BCD6s, BCD8s, BCD9, VIPowerM0-3, 5 and 7oElmos: moBosch: BCD6, BCD8oNXP: A-BCD3, A-BCD9oIXYS: SOI high VoltageoFreescale: SMARTMOS8, SMARTMOS10 WoTexas Instruments: LBC5, LBC5-SOI, LBC8, LBC9oLinear Technology : BCD moAnalog Devices: BCD m, BCD moMaxim-TowerJazz: BCD moDenso: m, SOI-BCD moRenesas: BCD moToyota: SOI-BCD moToshiba.

9 SOI high VoltageComparisonFeedbacksRelatedReports About System PlusInfineon SPT9 Memory6T-SRAM Cell -SEM ViewROM Cell -SEM ViewFlash Cell -SEM View 2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 202012SP20485 Overview/ IntroductionEvolution of BCD TechnologiesFoundry technologies ReviewoInfineon: SPT9, SMART6, SOIoSTMicroelectronics: BCD6s, SOI-BCD6s, BCD8s, BCD9, VIPowerM0-3, 5 and 7oElmos: moBosch: BCD6, BCD8oNXP: A-BCD3, A-BCD9oIXYS: SOI high VoltageoFreescale: SMARTMOS8, SMARTMOS10 WoTexas Instruments: LBC5, LBC5-SOI, LBC8, LBC9oLinear Technology : BCD moAnalog Devices: BCD m, BCD moMaxim-TowerJazz: BCD moDenso: m, SOI-BCD moRenesas: BCD moToyota: SOI-BCD moToshiba: SOI high VoltageComparisonFeedbacksRelatedReports About System PlusInfineon SPT9 Wafer Cost Hypothesis 2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 202013SP20485 Overview/ IntroductionEvolution of BCD TechnologiesFoundry technologies ReviewoInfineon: SPT9, SMART6, SOIoSTMicroelectronics: BCD6s, SOI-BCD6s, BCD8s, BCD9, VIPowerM0-3, 5 and 7oElmos: moBosch: BCD6, BCD8oNXP: A-BCD3, A-BCD9oIXYS: SOI high VoltageoFreescale: SMARTMOS8, SMARTMOS10 WoTexas Instruments: LBC5, LBC5-SOI, LBC8, LBC9oLinear Technology : BCD moAnalog Devices: BCD m, BCD moMaxim-TowerJazz: BCD moDenso: m, SOI-BCD moRenesas: BCD moToyota: SOI-BCD moToshiba.

10 SOI high VoltageComparisonFeedbacksRelatedReports About System PlusInfineon Thin- film SOI Transistors 2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 202014SP20485 Overview/ IntroductionEvolution of BCD TechnologiesFoundry technologies ReviewoInfineon: SPT9, SMART6, SOIoSTMicroelectronics: BCD6s, SOI-BCD6s, BCD8s, BCD9, VIPowerM0-3, 5 and 7oElmos: moBosch: BCD6, BCD8oNXP: A-BCD3, A-BCD9oIXYS: SOI high VoltageoFreescale: SMARTMOS8, SMARTMOS10 WoTexas Instruments: LBC5, LBC5-SOI, LBC8, LBC9oLinear Technology : BCD moAnalog Devices: BCD m, BCD moMaxim-TowerJazz: BCD moDenso: m, SOI-BCD moRenesas: BCD moToyota: SOI-BCD moToshiba: SOI high VoltageComparisonFeedbacksRelatedReports About System PlusInfineon Thin- film SOI Wafer Cost Breakdown 2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 202015SP20485 Overview/ IntroductionEvolution of BCD TechnologiesFoundrytechnologies ReviewComparisonFeedbacksRelatedReportsA bout System PlusComparison Table 10mm Die Price 2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 202016SP20485 Overview/ IntroductionEvolution of BCD TechnologiesFoundrytechnologies ReviewComparisonFeedbacksRelatedReportsA bout System PlusWafer Cost by Technology Node 2020 by System Plus Consulting| SP20485 -BCD Technology & Cost Comparison 202017SP20485 Overview/ IntroductionEvolution of BCD TechnologiesFoundrytechnologies ReviewComparisonFeedbacksRelatedReportsA bout System PlusREVERSE COSTING