Transcription of CALL FOR PAPERS - imws-ieee.org
{{id}} {{{paragraph}}}
IEEE MTT-S International Microwave Workshop Serieson Advanced Materials and ProcessesAnn Arbor, Michigan, 16-18 July 2018 Conference General Chair Amir MortazawiUniversity of Michigan, Ann Arbor, General Co-ChairRaafat MansourUniversity of Waterloo, Waterloo, ON, Canada Program ChairRobert WeigelInstitute of Electronics Engineering, Program Co-Chairs Christopher NordquistSandia National Laboratories, NM, HagelauerInstitute of Electronics Engineering, Germany University, China Finance ChairPai-Yen ChenWayne State University, Conference Details call FOR PAPERS IMWS-AMP2018conferencerepresentsauniquea ndunprecedentedopportunitytobringtogethe rresearchersandpractitionersofdifferentb ackground(materialsscientists,chemicalex perts,physicists,microwaveengineersandpr ocesstechnologists),tosharethemostrecent advancesinnewmaterialsandmanufacturingpr ocesses,whichrepresentthekeyforthedevelo pmentoffutureRF,microwave,mm-waveandTHzd evices, (MTT-S)withthetechnicalco-sponsorshipoft heEuropeanMicrowaveAssociation(EuMA).
IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes Ann Arbor, Michigan, 16-18 July 2018 Conference General Chair
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
{{id}} {{{paragraph}}}
COMSOL Multiphysics Software Price List, Multiphysics, Experiences from modeling very thin, Experiences from modeling very thin structures in COMSOL Multiphysics, ANSYS AUTODYN Explicit Software for Nonlinear, Reliability Models to Predict Engineering, Reliability Models to Predict Engineering Systems 'Failures and