Transcription of Chapter 12 Chemical Mechanical Polishing - …
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Chapter 12 Chemical Mechanical Polishing - …
11 Chapter 12 Chemical MechanicalPolishing2 Objectives List applications of CMP Describe basic structure of a CMP system Describe slurries for oxide and metal CMP Describe oxide CMP process. Describe metal Polishing process. Explain the post-CMP clean23 MaterialsDesignMasksIC FabTestPackagingFinal TestThermalProcessesPhoto-lithographyEtc hPR stripImplantPR stripMetalizationCMPD ielectricdepositionWafersWafer Process Flow4 Overview Multi layer metal interconnection is required Planarization of dielectric layers is important Depth of focus (DOF) requires a flat surface toachieve high resolution The rough dielectric surface can also causeproblems in later metallization35 Tungsten CMP Tungsten has been used to form metal plugs CVD tungsten fills contact/via holes andcovers the whole wafer.
1 1 Chapter 12 Chemical Mechanical Polishing 2 Objectives •List applications of CMP •Describe basic structure of a CMP system •Describe slurries for oxide and metal CMP
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