Transcription of CHAPTER 12: PRINTED CIRCUIT BOARD (PCB) DESIGN ISSUES
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CHAPTER 12: PRINTED CIRCUIT BOARD (PCB) DESIGN ISSUES
PRINTER CIRCUIT BOARD ISSUES CHAPTER 12: PRINTED CIRCUIT BOARD (PCB) DESIGN ISSUES INTRODUCTION SECTION : PARTITIONING SECTION : TRACES RESISTANCE OF CONDUCTORS VOLTAGE DROP IN SIGNAL LEADS "KELVIN FEEDBACK" SIGNAL RETURN CURRENTS GROUND NOISE AND GROUND LOOPS GROUND ISOLATION TECHNIQUES STATIC PCB EFFECTS SAMPLE MINIDIP AND SOIC OP AMP PCB GUARD LAYOUTS DYNAMIC PCB EFFECTS INDUCTANCE STRAY INDUCTANCE MUTUAL INDUCTANCE PARASITIC EFFECTS IN INDUCTORS Q OR "QUALITY FACTORS" DON'T OVERLOOK ANYTHING STRAY CAPACITANCE CAPACITATIVE NOISE AND FARADAY SHIELDS BUFFERING ADCs AGAINST LOGIC NOISE HIGH CIRCUIT IMPEDANCES ARE SUSCEPTIBLE TO NOISE PICKUP SKIN EFFECT TRANSMISSION LINES DESIGN PCBs THOUGHTFULLY DESIGNNING+B46 CONTROLLED IMPEDANCE TRACES ON PCBs
Printed circuit boards (PCBs) are by far the most common method of assembling modern electronic circuits. Comprised of a sandwich of one or more insulating layers and one or more copper layers which contain the signal traces and the powers and grounds, the design of the layout of printed circuit boards can be as demanding as the design of the
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