Transcription of CHAPTER 6 THERMAL DESIGN CONSIDERATIONS - NXP
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CHAPTER 6 THERMAL DESIGN CONSIDERATIONS - NXP
CHAPTER 6 THERMAL DESIGN CONSIDERATIONS pageIntroduction6 - 2 THERMAL resistance6 - 2 Junction temperature6 - 2 Factors affecting Rth(j-a)6 - 2 THERMAL resistance test methods6 - 3 Test procedure6 - 3 Forced air factors for THERMAL resistance6 - 4 THERMAL resistance data - assumptions and precautions6 - 5 THERMAL resistance (Rth(j-a)) data6 - 6 THERMAL resistance (Rth(j-c)) data tables - power packages6 - 24 April 20006 - 2 Philips SemiconductorsIC PackagesThermal DESIGN considerationsChapter 6 INTRODUCTIONThe ability to describe the THERMAL performancecharacteristics of a semiconductor IC package isbecoming increasingly crucial. With increased powerdensities, improved reliability and shrinking system sizes,the cooling of IC packages has become a challenging taskfor DESIGN engineers. The situation is further exacerbatedby the demand for ever decreasing sizes of electronicdevices because, in general, decreasing the size of anelectronic package decreases the THERMAL designer must carefully balance the benefits ofminiaturization and performance against the potentialreduction in reliability of electronic components resultingfrom high operating RESISTANCEThe ability of a particular semiconductor package todissipate heat to its environment is expressed in terms ofthermal resistance (Rth(j-a)).
5. Thermal resistance will vary slightly as a function of input power. Generally, as the power input increases, thermal resistance decreases. Thermal resistance changes approximately 5% for a 100% power change. 6. Thermal resistance data for some packages were not available at the time of publication. Please contact
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