Transcription of CHAPTER 6 THERMAL DESIGN CONSIDERATIONS - NXP
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CHAPTER 6 THERMAL DESIGN CONSIDERATIONS - NXP
CHAPTER 6 THERMAL DESIGN CONSIDERATIONS pageIntroduction6 - 2 THERMAL resistance6 - 2 Junction temperature6 - 2 Factors affecting Rth(j-a)6 - 2 THERMAL resistance test methods6 - 3 Test procedure6 - 3 Forced air factors for THERMAL resistance6 - 4 THERMAL resistance data - assumptions and precautions6 - 5 THERMAL resistance (Rth(j-a)) data6 - 6 THERMAL resistance (Rth(j-c)) data tables - power packages6 - 24 April 20006 - 2 Philips SemiconductorsIC PackagesThermal DESIGN considerationsChapter 6 INTRODUCTIONThe ability to describe the THERMAL performancecharacteristics of a semiconductor IC package isbecoming increasingly crucial. With increased powerdensities, improved reliability and shrinking system sizes,the cooling of IC packages has become a challenging taskfor DESIGN engineers. The situation is further exacerbatedby the demand for ever decreasing sizes of electronicdevices because, in general, decreasing the size of anelectronic package decreases the THERMAL designer must carefully balance the benefits ofminiaturization and performance against the potentialreduction in reliability of electronic components resultingfrom high operating RESISTANCEThe ability of a particular semiconductor package todissipate heat to its environment is expressed in terms ofthermal resistance (Rth(j-a)).
Thermal design considerations Chapter 6 Lead Frame Design The design of a lead frame is another significant contributing factor to thermal resistance. The most important design aspect is the IC attach-pad size and tie bar design. However, the lead frame designer is often faced with fixed parameters such as die size and wire
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