Transcription of Chapter 9 Metal-Semiconductor Contacts
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Semiconductor Devices for Integrated Circuits (C. Hu)Slide 9-1 Chapter 9 Metal-Semiconductor Contacts :metal on lightly doped silicon rectifyingSchottky diodesmetal on heavily doped silicon low-resistanceohmic contactsSemiconductor Devices for Integrated Circuits (C. Hu)Slide Schottky BarriersEnergy Band Diagram of Schottky Contact B Bq Bnq BpEgq BnEcEcEfEfEvEvq BpSemiconductor Devices for Integrated Circuits (C. Hu)Slide 9-3 Schottky barrier heights for electrons and holes Bn Bn Bp m Bn Bp Semiconductor Devices for Integrated Circuits (C. Hu)Slide 9-4 Bn Increases with Increasing Metal Work Functionq BnEcEvEfEq M Siq Bn=q M SiSemiconductor Devices for Integrated Circuits (C. Hu)Slide 9-5 Bn is typically to VEfEcQuestion Bpq BnEcEvEfEq M Si+ Semiconductor Devices for Integrated Circuits (C. Hu)Slide 9-6 Schottky barrier heights of metal silicide on Simetal-silicon contact Bn BpSemiconductor Devices for Integrated Circuits (C.)
The MESFET has similar IV characteristics as the MOSFET, but does not require a gate oxide. N-channel N+ N+ metal gate source drain GaAs Semi-insulating substrate Question: What is the advantage of GaAs over Si? Semiconductor Devices for Integrated Circuits (C. Hu) Slide 9-16
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