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Compact Modeling for RF and Microwave Integrated Circuits

Compact Modeling for RF and Microwave Integrated CircuitsA. M. Niknejad1, M. Chan1,2, C. Hu1,3, B. Brodersen1X. Xi1, J. He1, Y. Cao1, S. Emami-Neyestanak1C. Doan1,P. Su1, H. Wan1, M. Dunga1, C. H. Lin11 University of California, Berkeley2 Hong Kong University of Science and Technology3 TSMCBSIMO utline RF and Microwave Applications Insights from Maxwell s Equations Inductors and Transformers Capacitors and Varactors Transmission Lines and Resistors Substrate Coupling, IC Interconnect Package and PCB Modeling Active Device ModelingApplications of Compact Models Narrow-band impedance matching Tuned loads (resonant tank)

C. Doan1,P. Su1, H. Wan1, M. Dunga1, C. H. Lin1 1 University of California, Berkeley 2 Hong Kong University of Science and Technology 3 TSMC BSIM. Outline • RF and Microwave Applications • Insights from Maxwell’s Equations • Inductors and Transformers • Capacitors and Varactors

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