Transcription of Compact Modeling for RF and Microwave Integrated Circuits
{{id}} {{{paragraph}}}
Compact Modeling for RF and Microwave Integrated CircuitsA. M. Niknejad1, M. Chan1,2, C. Hu1,3, B. Brodersen1X. Xi1, J. He1, Y. Cao1, S. Emami-Neyestanak1C. Doan1,P. Su1, H. Wan1, M. Dunga1, C. H. Lin11 University of California, Berkeley2 Hong Kong University of Science and Technology3 TSMCBSIMO utline RF and Microwave Applications Insights from Maxwell s Equations Inductors and Transformers Capacitors and Varactors Transmission Lines and Resistors Substrate Coupling, IC Interconnect Package and PCB Modeling Active Device ModelingApplications of Compact Models Narrow-band impedance matching Tuned loads (resonant tank)
C. Doan1,P. Su1, H. Wan1, M. Dunga1, C. H. Lin1 1 University of California, Berkeley 2 Hong Kong University of Science and Technology 3 TSMC BSIM. Outline • RF and Microwave Applications • Insights from Maxwell’s Equations • Inductors and Transformers • Capacitors and Varactors
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
{{id}} {{{paragraph}}}