Transcription of Cree XLamp LEDs
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Cree XLamp LEDs
CLD-AP134 rev 1F. Support document Cree XLamp leds Solder Joint Reliability Study Table of Contents Executive Summary Executive Commercial applications of high-power leds have dramatically increased over the last several years because of leds ' high Assembly of Materials and reliability, long lifetime and energy savings potential. There are Test Board high expectations for LED-based luminaires for commercial, MCPCB indoor, outdoor and residential applications. LED-based Solder luminaires are increasingly required to meet the reliability Solder standards and ENERGY STAR requirements for long term Assembly Process lumen maintenance (L70 > 35,000 hours)1 [1]. Solder Reflow The reliability of the solder joint between the LED package X-ray and printed circuit board (PCB) is very critical in ensuring the Thermal Shock overall reliability of an LED lighting fixture. This application note Thermal Shock Test describes a reliability investigation of solder joints for Cree high- Thermal Shock Test power XLamp leds using thermal shock testing.
Copyright 2013-2018 Cree, Inc. All rights reserved. The information in this document is subject to change ithout notice. Cree ® and XLamp are registered trademarks and the Cree logo is a trademark
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