Transcription of PACKAGE QUALIFICATION SUMMARY REPORT
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PACKAGE QUALIFICATION SUMMARY REPORT
PACKAGE QUALIFICATION SUMMARY REPORT Document Control #: ML1120110066 Purpose: To provide QUALIFICATION SUMMARY REPORT for all packages Device: Various Mask Identification #: Various Process Technology: Pure Matte Tin (Sn) Plating Process 400 in (10 m) 1000 in (25 m), Pre-Plated Leadframe (PPF), or SnAgCu based solder bump Product: Various devices plated with Matte Tin, PPF, or with solder spheres Updated: May 18, 2017 PACKAGE QUALIFICATION SUMMARY REPORT DOCUMENT CONTROL # ML1120110066 Microchip Technology Inc.
Package Qualification Summary Report DOCUMENT CONTROL # ML1120110066 Microchip Technology Inc. 6 2 RELIABILITY TEST DESCRIPTIONS 2.1 Preconditioning
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