Transcription of DC-to-DC Design Guide
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DC-to-DC Design Guide
AN607 vishay SiliconixDocument Number: Design GuideSergeJaunay,JessBrownINTRODUCTIONM anufacturers of electronic systems that require powerconversion are faced with the need for higher-density dc-to-dcconverters that perform more efficiently, within a smallerfootprint, and at lower cost despite increasing output meet these demands, Siliconix has combined advancedTrenchFETRand PWM-optimized process technologies,along with innovative new packages, to provide:Dlowest on-resistance for minimum power dissipationDlowest gate charge for minimum switching lossesDdV/dt shoot-through immunity1 Dimproved thermal in thermal management for increasing powerdensity are being achieved with vishay Siliconix packagingtechnologies such as the PowerPAKt(Si7000 Series), thethick leadframe D2 PAK(SUM Series),and ChipFETt(Si5000 Series).
AN607 Vishay Siliconix Document Number: 71917 10-Oct-02 www.vishay.com 1 DC-to-DC Design Guide Serge Jaunay, Jess Brown INTRODUCTION Manufacturers of electronic systems that require power
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