Transcription of DC-to-DC Design Guide - Vishay Intertechnology
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DC-to-DC Design Guide - Vishay Intertechnology
AN607 Vishay SiliconixDocument Number: Design GuideSergeJaunay,JessBrownINTRODUCTIONM anufacturers of electronic systems that require powerconversion are faced with the need for higher-density dc-to-dcconverters that perform more efficiently, within a smallerfootprint, and at lower cost despite increasing output meet these demands, Siliconix has combined advancedTrenchFETRand PWM-optimized process technologies,along with innovative new packages, to provide:Dlowest on-resistance for minimum power dissipationDlowest gate charge for minimum switching lossesDdV/dt shoot-through immunity1 Dimproved thermal in thermal management for increasing powerdensity are being achieved with Vishay Siliconix packagingtechnologies such as the PowerPAKt(Si7000 Series), thethick leadframe D2 PAK(SUM Series),and ChipFETt(Si5000 Series).DThe PowerPAK SO-8 offers the steady-state thermalresistance of a DPAK in an SO-8 PowerPAK 1212-8 is approximately half the size of aTSSOP-8 while decreasing the thermal resistance by anorder of SUM Series reduces thermal resistance by 33% overstandard D2 PAK is 40% smaller than a TSOP-6 package whileoffering lower on-resistance and lower thermal should be noted that lower thermal resistance results inhigher possible maximum current and power complete array of Vishay Siliconix MOSFET-packagedproducts ranges from the D2 PAK (SUM or SUB series), DPAK(SUD Series), and PowerPAK (Si7000 Series) types ofpackages to the LITTLE FOOTR packages.
AN607 Vishay Siliconix Document Number: 71917 10-Oct-02 www.vishay.com 1 DC-to-DC Design Guide Serge Jaunay, Jess Brown INTRODUCTION Manufacturers of electronic systems that …
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