Transcription of DC-to-DC Design Guide - Vishay Intertechnology
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DC-to-DC Design Guide - Vishay Intertechnology
AN607 Vishay SiliconixDocument Number: Design GuideSergeJaunay,JessBrownINTRODUCTIONM anufacturers of electronic systems that require powerconversion are faced with the need for higher-density dc-to-dcconverters that perform more efficiently, within a smallerfootprint, and at lower cost despite increasing output meet these demands, Siliconix has combined advancedTrenchFETRand PWM-optimized process technologies,along with innovative new packages, to provide:Dlowest on-resistance for minimum power dissipationDlowest gate charge for minimum switching lossesDdV/dt shoot-through immunity1 Dimproved thermal in thermal management for increasing powerdensity are being achieved with Vishay Siliconix packagingtechnologies such as the PowerPAKt(Si7000 Series), thethick leadframe D2 PAK(SUM Series),and ChipFETt(Si5000 Series).
Non-isolated Buck Converter Basic operation Thebuck(orstep-down)converter,showninFigure5,isused to convert a positive dc voltage to a lower positive dc …
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