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Design and Assembly Process Implementation for …
IPC-7094 Design and AssemblyProcess Implementationfor flip chip and DieSize ComponentsDeveloped by the flip chip Mounting Strategy Task Group of theAssembly & Joining Processes Committee of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1249 Tel 847 847 Table of .. 12 APPLICABLE .. 23 REQUIREMENTS AND and definitions .. or Die .. Element .. Package .. Module .. of flip chip Mounting .. of flip chip Mounting .. of Die Size and chip Scale ArrayPackaging .. BGA ( BGA) .. BGA .. Outline No Lead chip Scale Packages(SON and QFN) .. of Die Size Package Technology .. 74 flip chip Design Consideration .. Circuitry .. Metal Traces .. and capacitance .. Frequency Performance .. Design .. Interconnect Thermal Model .. chip Preparation for Mounting .. Guide Checklist.
IPC-7094 Design and Assembly Process Implementation for Flip Chip and Die Size Components Developed by the Flip Chip Mounting Strategy Task Group of the
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