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Design and Assembly Process Implementation for Bottom ...
IPC-7093.. Design and Assembly Process Implementation for Bottom Termination SMT Components Developed by the IPC Bottom Termination Components (BTC) Task Group (5-21h) of the Assembly & Joining Processes Committee (5-20). of IPC. Users of this publication are encouraged to participate in the development of future revisions. Contact: IPC. 3000 Lakeside Drive, Suite 309S. Bannockburn, Illinois 60015-1249. Tel 847 Fax 847 March 2011 IPC-7093. Table of Contents 1 SCOPE ..1 Marking Alternatives ..24. Purpose ..1 Materials Used ..24. Intent ..1 Description of Commercial Variations ..24. Detailed Description of MLF , MLP, and 2 APPLICABLE DOCUMENTS ..1. MLFP Components ..25. IPC ..1. Detailed Description of LLC and LFCSP . JEDEC ..2 Components ..27. Packaging and Handling ..30. 3 SELECTION CRITERIA AND MANAGING BTC. Implementation ..2. 5 MOUNTING STRUCTURES ..31. Terms and Definitions.
IPC-7093 Design and Assembly Process Implementation for Bottom Termination SMT Components Developed by the IPC Bottom Termination Components (BTC) Task
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