Transcription of Design Guidelines for Reliable Surface Mount …
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IPC-D-279 Design Guidelines for ReliableSurface Mount TechnologyPrinted Board AssembliesIPC-D-279 July 1996 The Institute forInterconnectingand PackagingElectronic Circuits2215 Sanders RoadNorthbrook, Illinois60062-6135 TelFaxURL:847 of .. Philosophy .. the Design Team .. Reliability Requirements .. the Product Life the Product Organization .. for Reliability of SM Assemblies .. Materials and Coatings .. Processes and .. and for Interconnecting and PackagingElectronic Circuits (IPC) .. Industries Association .. Industry Standards .. FOR RELIABILITY FOR SURFACEMOUNT Cycle Environment .. Processes .. Temperature Excursions .. and Environmental Stress Screening(ESS).
IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies IPC-D-279 July 1996 The Institute for Interconnecting and Packaging
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