Transcription of Guidelines for Accelerated Reliability Testing of …
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Guidelines for Accelerated Reliability Testing of …
ASSOCIATION CONNECTING. ELECTRONICS INDUSTRIES. IPC-SM-785. Guidelines for Accelerated Reliability Testing of Surface mount Solder Attachments IPC-SM-785. November 1992 A guideline developed by IPC. 2215 Sanders Road, Northbrook, IL 60062-6135. Tel. Fax IPC-SM-785 November 1992. Table of Contents SCOPE .. 1 Creep Rupture 33. 1 Mechanical Shock 34. Document Organization .. 1 Failure Criteria for Solder Joint Fatigue Tests .. 34. APPLICABLE DOCUMENTS .. 2. Accelerated Life Test Planning .. 35. 2. Failure Mode 38. Joint Industry Standards .. 2. Reporting 41. 2. Other 2 Appendix A Step-by-Step Example .. 43. REQUIREMENTS Appendix B References .. 45. Terms and 3 Appendix C Bibliography .. 46. Reliability Concepts and 5. Reliability Assurance .. 6 Figures Damage/Failure Mechanisms .. 10 Figure 1 Flowchart for 4. Application 12 Figure 2 Generic Reliability bathtub'' curves comparing electronic components and surface mount SURFACE mount SOLDER ATTACHMENT solder attachment.
Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments 1.0 SCOPE This document provides guidelines for accelerated reliabil-
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