Transcription of Device Marking Conventions (Rev. C)
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Device Marking Conventions (Rev. C)
ApplicationReportSNOA039C May2004 dependentonthesizeofthedevicepackageandt heareaavailableformarking, (WaferLot) May2004 RevisedJuly2005 DeviceMarkingConventionsSubmitDocumentat ionFeedbackCopyright 2004 2005, dependentonthesizeofthedevicepackageandt heareaavailableformarking, givendeviceis givenin usuallycontainedin :Manufacturinginformation Companylogo Waferand/orassemblyplantcodes(optional)( seeTable1 andTable2) Datecode(seeTable4, Table5, andTable6) Dierun(waferlot)codeSecondLine:Devicepar tnumber Devicefamily(seeTable7) Devicetype Options Packagecode(seeTable8)Thirdorfourthline: Optional,dependingondevice,packagesize,a ndcustomer Continuationofdeviceidentification(iftoo longforthesecondline) Stampoff numberasrequiredbyspecificcustomerreques tandspecification Notice(s)relatedtocopyrightortrademarksV erysmallpackages,suchasSOT-23,SOT-223,SC 70,andSC90, assigneddifferently,consistingofa four-charactercode: Devicetype(seeTable10) Deviceidentificationcode GradeThesesmallpackagesalsohavea a one-characteralphacodethatrepresentsa particular6-weekperiodduringa givendevicecanbefoundin ,whichwouldbetypicallyfoundin the firstline Marking ,is , Figure2, andFigure3 showthetypicalarrangementofmarkingonlarg e,medium, thedevicemarkingarelistedin , May2004 RevisedJuly2005 SubmitDocumentationFeedbackCopyright 2004 2005, listssingle-lettercodesforNationalSemico nductor' thislisti
www.ti.com National Semiconductor marks devices sold in order to provide device identification and manufacturing traceablility information. The method of presenting the information marked on the device is dependent on
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