Transcription of Device Marking Conventions (Rev. C)
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Device Marking Conventions (Rev. C)
ApplicationReportSNOA039C May2004 dependentonthesizeofthedevicepackageandt heareaavailableformarking, (WaferLot) May2004 RevisedJuly2005 DeviceMarkingConventionsSubmitDocumentat ionFeedbackCopyright 2004 2005, dependentonthesizeofthedevicepackageandt heareaavailableformarking, givendeviceis givenin usuallycontainedin :Manufacturinginformation Companylogo Waferand/orassemblyplantcodes(optional)( seeTable1 andTable2) Datecode(seeTable4, Table5, andTable6) Dierun(waferlot)codeSecondLine:Devicepar tnumber Devicefamily(seeTable7) Devicetype Options Packagecode(seeTable8)Thirdorfourthline: Optional,dependingondevice,packagesize,a ndcustomer Continuationofdeviceidentification(iftoo longforthesecondline) Stampoff numberasrequiredbyspecificcustomerreques tandspecification Notice(s)relatedtocopyrightortrademarksV erysmallpackages,suchasSOT-23,SOT-223,SC 70,andSC90, assigneddifferently,consistingofa four-charactercode: Devicetype(seeTable10) Deviceidentificationcode GradeThesesmallpackagesalsohavea a one-characteralphacodethatrepresentsa particular6-weekper
www.ti.com National Semiconductor marks devices sold in order to provide device identification and manufacturing traceablility information. The method of presenting the information marked on the device is dependent on
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