Transcription of dvanced Packaging Technologies for Miniaturized Modules
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dvanced Packaging Technologies for Miniaturized Modules
dvanced Packaging Technologies for MiniaturizedModulesVinayak PandeyVP, Product Technology Marketing, STATS ChipPACForm FactorPerformanceIntegrationLow CostAnalog Package RequirementsAnalog Package TrendsfcQFN FCOL/MIS QFN-dr/mr2L WB laminate/ 1L(Single Metal SueWLB 1L RDLQFNQFP1L WB - MIS1/2L FC - MISMIS can be used for leaded/laminate wirebond& flip chip Packaging eWLB drives superior performance and integrationFlip chipWirebondSingle Metal SubstrateFlip Chip on LeadFrameMolded Interconnect Substrate/systemEmbedded Wafer Level Ball Grid ArrayMIS (Molded Interconnect System/Substrate)Carrier4 Pre-mold compoundFinish plating.)
dvanced Packaging Technologies for Miniaturized Modules Vinayak Pandey VP, Product Technology Marketing, STATS ChipPAC
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