Search results with tag "Wafer level"
スマートフォンから見るICT技術
www.ieice.org図2 WLP（Wafer Level Chip Scale Package） Fan-out area Fan-out area Interconnects 図3 FO-WLP（Fan Out-Wafer Level Package） 図4 FO-WLPとフリップチップの熱変形 （8） 解説 スマートフンの性化を現する端半導体パッケージ 167 小特集 スマートフォンから見るICT技術
Yield and Yield Management - Smithsonian Institution
smithsonianchips.si.eduFigure 3-2. Typical 1996 Silicon Wafer IC Probe Yield Losses Figure 3-3. Sources of Wafer-Level Contamination Source: CleanRooms 19973A People Cleanroom Processes Equipment 0 10 20 30 40 50 60 70 80 90 100 1985 1990 1995 2000 Percent Year
Packaging Material System for Electronic Devices
www.hitachi-chem.co.jp8 日立化成テクニカルレポートNo.40（2003-1） 総 説 ッケージングを行うWL（Wafer Level）-CSPが開発されてい る2 ），3 。 一方，チップとインタポーザの接続方法として現在
MEMS & Sensors packaging: Wafer-Level …
www.semiconwest.orgA group of companies Market, technology and strategy consulting www.yole.fr M&A operations Due diligences www.yolefinance.com Innovation and business maker
Wafer-Level Chip Scale Package (WLCSP)
docs.broadcom.comThis application note provides an overview of Broadcom's WLCSP (Wafer-Level Chip Scale Package) technology and includes design and manufacturing guidelines for high yield and high reliability assembly. WLCSP OVERVIEW Broadcom’s WLCSP technology offers a high-density, low form-factor package solution that is ideal for mobile applications
Wafer Level micro-Encapsulation - MEMtronics
www.memtronics.comWafer Level micro-Encapsulation David I. Forehand and Charles L. Goldsmith MEMtronics Corporation Plano, Texas, USA 75075 dforehand@memtronics.com