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Wafer-Level Chip Scale Package (WLCSP)

APPLICATION NOTEWLCSPPACKAGING-AN300-R16215 Alton Parkway Box 57013 Irvine, CA 92619-7013 Phone: 949-450-8700 Fax: 949-450-871012/31/03 Wafer-Level Chip Scale Package (WLCSP)OVERVIEW AND ASSEMBLY GUIDELINESB roadcom Box 5701316215 Alton ParkwayIrvine, CA 92619-7013 2003 by Broadcom CorporationAll rights reservedPrinted in the and the pulse logo are registered trademarks of Broadcom Corporation and/or its subsidiaries in the UnitedStates and certain other countries. All other trademarks mentioned are the property of their respective HISTORYR evision DateChange DescriptionPACKAGING-AN300-R12/31/03 Initial releaseApplication Note WLCSP12/31/03 Broadcom CorporationDocumentPACKAGING-AN300-RPage iiiTABLE OF 1 WLCSP 1 WLCSP Process process.

This application note provides an overview of Broadcom's WLCSP (Wafer-Level Chip Scale Package) technology and includes design and manufacturing guidelines for high yield and high reliability assembly. WLCSP OVERVIEW Broadcom’s WLCSP technology offers a high-density, low form-factor package solution that is ideal for mobile applications

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