PDF4PRO ⚡AMP

Modern search engine that looking for books and documents around the web

Example: confidence

LONGi P-type Monocrystalline Wafer Specification

LONGi P-type Monocrystalline Wafer Specification P ( ) LONGi P-type Monocrystalline Wafer Specification P ( ) 1 Material properties Property Specification Inspection Method Growth method CZ -- Crystallinity Monocrystalline Preferential Etch Techniques ASTM F47-88 Conductivity type P-type P Napson EC-80 TPN P/N Dopant Gallium -- Oxygen concentration [Oi] 8E + 17 at/cm3 FTIR (ASTM F121-83) Carbon Concentration [Cs] 5E + 16 at/ cm3 FTIR ASTM F123-91 Etch pit density (dislocation density) 500 cm-2 Preferential Etch Techniques ASTM F47-88 Surface orientation <100> 3 X-ray Diffraction Method ASTM F26-1987 X Orientation of pseudo square sides <010>, <001> 3 X-ray Diffraction Method ASTM F26-1987 X LONGi P-type Monocrystalline Wafer Specification P ( ) 2 Electrical properties Property Specification Inspection Method Resistivity.

(with injection level: 1E15 cm-3) 3、Geometry几何尺寸 Property 项目 Specification 规格 Inspection Method 检测方法 Geometry 几何外形 Pseudo square 准方 -- Bevel edge shape 倒角边形状 Round 圆弧 -- Wafer Side length 硅片边距 182±0.25 mm wafer inspection system 硅片自动检测设备 Wafer Diameter

Fullscreen Download

Tags:

  Levels, Wafer

Information

Domain:

Source:

Link to this page:

Please notify us if you found a problem with this document:

Spam in document Broken preview Other abuse

Transcription of LONGi P-type Monocrystalline Wafer Specification

Related documents

Silicon Wafer Processing - National Chiao Tung University

jupiter.math.nctu.edu.tw

Class 10 clean room level. When wafers move into the process part of the machine, they are contained in a vacuum, with extremely low particle contamination levels (Class 1). Even the smallest particle can ruin an entire wafer, with a large number of integrated circuits affected, and costing hundreds or thousands of dollars. wafer.

  Levels, Wafer

Yield and Yield Management - Smithsonian Institution

smithsonianchips.si.edu

Figure 3-2. Typical 1996 Silicon Wafer IC Probe Yield Losses Figure 3-3. Sources of Wafer-Level Contamination Source: CleanRooms 19973A People Cleanroom Processes Equipment 0 10 20 30 40 50 60 70 80 90 100 1985 1990 1995 2000 Percent Year

  Management, Levels, Yield, Wafer, Wafer level, Yield and yield management

Cleaning Procedures for Silicon Wafers

www.inrf.uci.edu

Silicon wafer are cleaned by a solvent clean, Followed by a dionized water (DI) rinse, followed by an RCA clean and DI rinse, followed by an HF dip and DI rinse and blow dry. This is a level-1 process and requires basic INRF safety certification. The use of dangerous chemicals requires that the user may not perform the process alone. Time needed

  Procedures, Levels, Silicon, Cleaning, Wafer, Cleaning procedures for silicon wafers

Introduction to Semico nductor Manufacturing and FA Process

www.nexty-ele.com

Oct 06, 2017 · Wafer Back Grinding • The typical wafer supplied from ‘wafer fab’ is 600 to 750μm thick. • Wafer thinned down to the required thickness, 50um to 75um, by abrasive grinding wheel. › 1st step : Use a large grit to coarsely grind the wafer and remove the bulk of …

  Wafer

Wafer-Level Chip Scale Package (WLCSP)

docs.broadcom.com

This application note provides an overview of Broadcom's WLCSP (Wafer-Level Chip Scale Package) technology and includes design and manufacturing guidelines for high yield and high reliability assembly. WLCSP OVERVIEW Broadcom’s WLCSP technology offers a high-density, low form-factor package solution that is ideal for mobile applications

  Levels, Wafer, Wafer level

Manual: Rosemount DP Level Transmitters and 1199 …

www.emerson.com

2.1 DP Level and remote seal system measurement. DP Level is a reliable measurement solution for measuring level, density, interface, or mass of a process media inside a tank. Remote seal system measurement is unaffected by agitation, foam, or internal obstacles. Remote diaphragm seals extend limitations due to process conditions such as high and

  Levels

Understanding VNA Calibration - UMD

anlage.umd.edu

An important aspect of test-set power level is the consideration of dynamic range. Setting the port power to the maximum level before receiver compression provides the widest possible signal-to-noise floor ratio and thus dynamic range. Be sure to perform this setting before beginning calibration. Types of Calibrations

  Levels

Wet Etching - University of Washington

labs.ece.uw.edu

• The uniformity of an etch gives a bound on how level a surface it will produce after starting from an initially flat surface. – Uniformity is a long-scale measure of surface height variation. • The roughness of an etch gives a bound on how flat a surface it will produce after starting from an initially flat surface.

  Levels

Related search queries

Wafer, Level, Yield and Yield Management, Wafer-Level, Cleaning Procedures for Silicon Wafers