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Introduction to Semico nductor Manufacturing and FA Process

Introduction to Semiconductor Manufacturing and FA Process IPC Technical Seminar Kenny Seon (IFKOR QM IPC) 13-Sep-2017 Table of Contents Course Objective Basic Semiconductor Semiconductor Supply Chain Semiconductor Manufacturing Processes Overview Frontend End( wafer Fabrication) Process Back End(Assembly & Test) Process Semiconductor FA(Failure Analysis) Process 1 2 3 4 5 6 7 Copyright Infineon Technologies AG 2017. All rights reserved. Table of Contents Course Objective Basic Semiconductor Semiconductor Supply Chain Semiconductor Manufacturing Processes Overview Frontend End( wafer Fabrication) Process Back End(Assembly & Test) Process Semiconductor FA(Failure Analysis) Process 1 2 3 4 5 6 7 Copyright Infineon Technologies AG 2017. All rights reserved.

Oct 06, 2017 · Wafer Back Grinding • The typical wafer supplied from ‘wafer fab’ is 600 to 750μm thick. • Wafer thinned down to the required thickness, 50um to 75um, by abrasive grinding wheel. › 1st step : Use a large grit to coarsely grind the wafer and remove the bulk of …

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Introduction to Semico nductor Manufacturing …

www.nexty-ele.com

Introduction to Semico nductor Manufacturing and FA Process IPC Technical Seminar Kenny Seon (IFKOR QM IPC) 13-Sep-2017

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