Transcription of ELECTROPLATING VERSUS HOT - DIPPED TINNING A …
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This paper was presented at the CARTS-Europe `97 symposium in Prague. ELECTROPLATING VERSUS HOT - DIPPED TINNING A COMPARISON OF APPLICATION - EXPERIENCES Gerhard B rstner ( Dipl. Wirtsch. Ing. ) Eckhard Fr hlich (Dipl. Ing.) Feindrahtwerk Adolf Edelhoff GmbH & Co. Am Gro en Teich 33 D-58640 Iserlohn, Germany Phone: +49 2371 43800 Fax *49 2371 40097 E-mail: 1. SUMMARY On the CARTS-EUROPE 96 the topic Lead-Free Electrical Connections has already become a major issue [1]. Due to enviromental reasons and due to technology aspects lead-reduced or lead-free connections will become more important for passive components.
dipped tinning process. Edelhoff developed this process about ten years ago according to specific customer requirements. Nowadays there is a significant experience in running this advanced
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Next-Generation Sequencing: an overview of technologies, Tinning, Thick Film General Purpose chip resistors, GENERAL PURPOSE, VOC -FREE ORGANIC ACID, Zaclon Galvanizing Fluxes, IN-S63AT series, The Art of Soldering, American Radio Relay League, Application Note, Acousti Coat #150, Standard Thick Film Chip Resistors, Vishay Intertechnology